IC Stratix III DSP/Memory
EP3SE50 EP3SE80 EP3SE110 EP3SE260
IC Stratix III Logic
EP3SL50 EP3SL70 EP3SL110 EP3SL150 EP3SL200 EP3SL340
The Stratix? III family provides one of the most architecturally advanced,high-performance, low-power FPGAs in the marketplace.Stratix III FPGAs lower power consumption through Altera’s innovative Programmable Power Technology, EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152 which provides the ability to turn on the performance where needed and turn down the power consumption for blocks not in use. Selectable Core Voltage and the latest in silicon process optimizations are also employed to deliver the industry’s lowest power, high-performance FPGAs.Specifically designed for ease of use and rapid system integration, the Stratix III FPGA family offers two variants optimized to meet different application needs: EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
■ The Stratix III L family provides balanced logic, memory, and multiplier ratios for mainstream applications. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
■ The Stratix III E family is memory- and multiplier-rich for data-centric applications. Modular I/O banks with a common bank structure for vertical migration lend efficiency and flexibility to the high-speed I/O. Package and die enhancements with dynamic on-chip termination, output delay, and current strength control provide best-in-class signal integrity. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152 Based on a 1.1-V, 65-nm all-layer copper SRAM process, the Stratix III family is a programmable alternative to custom ASICs and programmable processors for high-performance logic, digital signal processing (DSP), and embedded designs.Stratix III devices include optional configuration bit stream security through volatile or non-volatile 256-bit Advanced Encryption Standard (AES) encryption. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152 Where ultra-high reliability is required, Stratix III devices include automatic error detection circuitry to detect data corruption by soft errors in the configuration random-access memory (CRAM) and user memory cells. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
Features Summary
Stratix III devices offer the following features:
■ 48,000 to 338,000 equivalent logic elements (LEs) ( refer to Table 1–1)
■ 2,430 to 20,497 Kbits of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory and FIFO buffers EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
■ High-speed DSP blocks provide dedicated implementation of 9×9, 12×12, 18×18, and 36×36 multipliers (at up to 550 MHz), multiply-accumulate functions, and finite impulse response (FIR) filter EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
■ I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for robust signal integrity EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
■ Programmable Power Technology, which minimizes power while maximizing device performance
Electrical Characteristics
This chapter describes the electrical characteristics, switching characteristics, and I/O timing for Stratix? III devices. Electrical characteristics include operating conditions and power consumption. Switching characteristics include core performance specifications and periphery performance. A glossary is also included for your reference. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
Operating Conditions
When Stratix III devices are implemented in a system, they are rated according to a set of defined parameters. To maintain the highest possible performance and reliability of Stratix III devices, system designers must consider the operating requirements described in this chapter. Stratix III devices are offered in both commercial and industrial grades. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152 Commercial devices are offered in –2 (fastest), –3, –4, and –4L speed grades. Industrial devices are offered only in –3, –4, and –4L speed grades. 1 In this chapter, a prefix associated with the operating temperature range is attached to the speed grades; commercial with a “C” prefix and industrial with an “I” prefix. For example, commercial devices are indicated as C2, C3, C4, and C4L per respective speed grades. Industrial devices are indicated as I3, I4, and I4L. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
Absolute Maximum Ratings
Absolute maximum ratings define the maximum operating conditions for Stratix III devices. The values are based on experiments conducted with the device and theoretical modeling of breakdown and damage mechanisms. The functional operation of the device is not implied at these conditions. Conditions beyond those listed in Table 1–1 may cause permanent damage to the device. Additionally, device operation at the absolute maximum ratings for extended periods may have adverse effects on the device. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
All Stratix III devices support vertical migration within the same package (for example, you can migrate between the EP3SL50 and EP3SL70 devices in the 780-pin FineLine BGA package). Vertical migration allows you to migrate to devices whose dedicated pins, configuration pins, and power pins are the same for a given package across device densities. To ensure that a board layout supports migratable densities within one package offering, enable the applicable vertical migration path within the Quartus? II software. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152 On the Assignments menu, point to Device and click Migration Devices.You can migrate from the L family to the E family without increasing the number of LEs available. This minimizes the cost of vertical migration. lists the Stratix III FineLine BGA (FBGA) package sizes. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152
Stratix III devices are hot-socketing compliant. Hot socketing is also known as hot plug-in or hot swap, and power sequencing support without the use of any external devices. Robust on-chip hot-socketing and power-sequencing support ensures proper device operation independent of the power-up sequence. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152 You can insert or remove a Stratix III board in a system during system operation without causing undesirable effects to the running system bus or the board that was inserted into the system. The hot-socketing feature makes it easier to use Stratix III devices on PCBs that also contain a mixture of 3.3-V, 3.0-V, 2.5-V, 1.8-V, 1.5-V, and 1.2-V devices. With the Stratix III hot socketing feature, you do not need to ensure a specific power-up sequence for each device on the board. EP3SE260F1152C3N Altera Stratix III DSP/Memory 260K FBGA1152