RF chip firm Amalfi snags another $20 million in funding

RF chip firm Amalfi snags another $20 million in funding

SAN FRANCISCO—Amalfi Semiconductor Inc., a designer of power amplifiers for cellular handsets, said Tuesday (April 24) it raised an additional $20 million in funding from previous investors  Battery Ventures, DCM and Globespan Capital Partners.

Amalfi (Los Gatos, Calif.) said it would use the new funding to expand its business operations and accelerate new product development programs of its next-generation CMOS power amplifier technologies.

Amalfi, founded in 2003, has now secured at least $76 million in four rounds of funding in its history. Most recently, in 2009, Amalfi announced it received $24 million in Series C funding from four investment firms, including the three that participated in this latest funding round.

Mark Foley, Amalfi's president and CEO, said through a statement that the company has experiencing tremendous growth with top tier customers and China ODM handset customers.

"We've had a tremendous year and a dramatic ramp up in the adoption of our products," Foley said. "As we grow rapidly, this additional funding accelerates our next phase of product development, while allowing us to guarantee exceptional customer service."

Amalfi, which claims to have shipped more than 75 million transmit modules, bills itself as the industry's leading CMOS power amplifier company. The company maintains that its current technology is primarily targeted for use in entry-level and ultra-low cost 2G GSM/GPRS cellular handsets in emerging markets.

Last August, Amalfi launched its second-generation AdaptiveRF architecture, designed to deliver industry-leading performance at significantly reduced costs compared to traditional GaAs modules.

"We have clearly been able to demonstrate the benefits of our CMOS technology at the 2G level," Foley said. "We will further drive these price and performance benefits for feature and entry-level smartphones while introducing new advanced products that apply these same CMOS integration benefits to 3G and LTE mobile phones and data terminals."

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