SAN FRANCISCO—Worldwide semiconductor manufacturing equipment billings reached $10.61 billion in the first quarter, up 14 percent from the previous quarter, but down 9 percent from the same period of 2011, according to fab tool vendor trade group SEMI.
Worldwide fab gear billings totaled $10.07 billion in the first quarter, up 13 percent from the fourth quarter of 2011, but down 9 percent from the first quarter of 2011,
SEMI (San Jose, Calif.) said.
The first quarter bookings and billings data was gathered jointly by SEMI and its Japanese counterpart, the Semiconductor Equipment Association of Japan, from more than 100 global equipment companies that provide data on a monthly basis, SEMI said.
