CD4010BPW Supplier,Distributor,Price,Datasheet,PDF

CD4010BPW distributor(IC BUFF/CONVERTER HEX 16TSSOP),CD4010BPW supplier

Part Number:   CD4010BPW
Description:   IC BUFF/CONVERTER HEX 16TSSOP
Category:   TI IC
Manufacture:   Texas Instruments(TI)
Package:   IC BUFF/CONVERTER HEX 16TSSOP
Standard Package:   
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CD4010BPW Distributor,Datasheet,PDF,Suppliers,Price


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1 pcs
Mininum order quantity from 1PCS CD4010BPW
Mininum order value from 1USD
2 days
lead time of CD4010BPW is from 2 to 5 days
12 hours
Fast quotation of CD4010BPW within 12 hours
60 days
60 days full quality warranty of CD4010BPW
 
1, we will give you new and original parts with factory sealed package
2, Quality warranted: All products have to be passed our Quality Control before delivery.
2,If you need more details of CD4010BPW,like pictures ,package,datasheet and so on, pls email to [email protected]

Upon entry to the Shift-DR state, the data register is placed in the scan path between TDI and TDO and, on the first falling edge of TCK, TDO goes from the high-impedance state to an active state.CD4010BPW Texas Instruments(TI) IC BUFF/CONVERTER HEX 16TSSOP, TDO enables to the logic level present in the least-significant bit of the selected data register.While in the stable Shift-DR state, data is shifted serially through the selected data register on each TCK cycle.The first shift occurs on the first rising edge of TCK after entry to the Shift-DR state (i.e., no shifting occurs during the TCK cycle in which the TAP controller changes from Capture-DR to Shift-DR or from Exit2-DR to Shift-DR).The last shift occurs on the rising edge of TCK, upon which the TAP controller exits the Shift-DR state.CD4010BPW Texas Instruments(TI) IC BUFF/CONVERTER HEX 16TSSOP Improved Speed and Package Replacement for the SN75LBC976 Designed to Operate at up to 20 Million Data Transfers per Second (Fast-20 SCSI) Nine Differential Channels for the Data and Control Paths of the Small Computer Systems Interface (SCSI) and Intelligent Peripheral Interface (IPI) SN75976A Packaged in Shrink Small-Outline Package with 25-Mil Terminal Pitch (DL) and Thin Shrink Small-Outline Package with 20-Mil Terminal Pitch (DGG) SN55976A Packaged in a 56-Pin Ceramic Flat Pack (WD)Two Skew Limits Available  ESD Protection on Bus Terminals Exceeds 12 kV Low Disabled Supply Current 8 mA Typ Thermal Shutdown Protection Positive- and Negative-Current LimitingPower-Up/Down Glitch Protection,CD4010BPW Texas Instruments(TI) IC BUFF/CONVERTER HEX 16TSSOP