1P1G126QDBVRQ1 Supplier,Distributor,Price,Datasheet,PDF

1P1G126QDBVRQ1 supplier(IC BUS BUFF TRI-ST N-INV SOT235),1P1G126QDBVRQ1 distributor

Part Number:   1P1G126QDBVRQ1
Description:   IC BUS BUFF TRI-ST N-INV SOT235
Category:   TI IC
Manufacture:   Texas Instruments(TI)
Package:   IC BUS BUFF TRI-ST N-INV SOT235
Standard Package:   
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1P1G126QDBVRQ1 Distributor,Datasheet,PDF,Suppliers,Price


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1 pcs
Mininum order quantity from 1PCS 1P1G126QDBVRQ1
Mininum order value from 1USD
2 days
lead time of 1P1G126QDBVRQ1 is from 2 to 5 days
12 hours
Fast quotation of 1P1G126QDBVRQ1 within 12 hours
60 days
60 days full quality warranty of 1P1G126QDBVRQ1
 
1, we will give you new and original parts with factory sealed package
2, Quality warranted: All products have to be passed our Quality Control before delivery.
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Upon entry to the Shift-DR state, the data register is placed in the scan path between TDI and TDO and, on the first falling edge of TCK, TDO goes from the high-impedance state to an active state.1P1G126QDBVRQ1 Texas Instruments(TI) IC BUS BUFF TRI-ST N-INV SOT235, TDO enables to the logic level present in the least-significant bit of the selected data register.While in the stable Shift-DR state, data is shifted serially through the selected data register on each TCK cycle.The first shift occurs on the first rising edge of TCK after entry to the Shift-DR state (i.e., no shifting occurs during the TCK cycle in which the TAP controller changes from Capture-DR to Shift-DR or from Exit2-DR to Shift-DR).The last shift occurs on the rising edge of TCK, upon which the TAP controller exits the Shift-DR state.1P1G126QDBVRQ1 Texas Instruments(TI) IC BUS BUFF TRI-ST N-INV SOT235 Improved Speed and Package Replacement for the SN75LBC976 Designed to Operate at up to 20 Million Data Transfers per Second (Fast-20 SCSI) Nine Differential Channels for the Data and Control Paths of the Small Computer Systems Interface (SCSI) and Intelligent Peripheral Interface (IPI) SN75976A Packaged in Shrink Small-Outline Package with 25-Mil Terminal Pitch (DL) and Thin Shrink Small-Outline Package with 20-Mil Terminal Pitch (DGG) SN55976A Packaged in a 56-Pin Ceramic Flat Pack (WD)Two Skew Limits Available  ESD Protection on Bus Terminals Exceeds 12 kV Low Disabled Supply Current 8 mA Typ Thermal Shutdown Protection Positive- and Negative-Current LimitingPower-Up/Down Glitch Protection,1P1G126QDBVRQ1 Texas Instruments(TI) IC BUS BUFF TRI-ST N-INV SOT235