1 pcs
Mininum order quantity from 1PCS CD4516BNSRG4
Mininum order value from 1USD
2 days
lead time of CD4516BNSRG4 is from 2 to 5 days
12 hours
Fast quotation of CD4516BNSRG4 within 12 hours
60 days
60 days full quality warranty of CD4516BNSRG4
1, we will give you new and original parts with factory sealed package
2, Quality warranted: All products have to be passed our Quality Control before delivery.
2,If you need more details of CD4516BNSRG4,like pictures ,package,datasheet and so on, pls email to [email protected]
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.CD4516BNSRG4 Texas Instruments(TI) IC PRESET BIN UP/DN CONV 16-SOP Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)CD4516BNSRG4 Texas Instruments(TI) IC PRESET BIN UP/DN CONV 16-SOP MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this pageCD4516BNSRG4 Texas Instruments(TI) IC PRESET BIN UP/DN CONV 16-SOP