1 pcs
Mininum order quantity from 1PCS UCC3809P-1G4
Mininum order value from 1USD
2 days
lead time of UCC3809P-1G4 is from 2 to 5 days
12 hours
Fast quotation of UCC3809P-1G4 within 12 hours
60 days
60 days full quality warranty of UCC3809P-1G4
1, we will give you new and original parts with factory sealed package
2, Quality warranted: All products have to be passed our Quality Control before delivery.
2,If you need more details of UCC3809P-1G4,like pictures ,package,datasheet and so on, pls email to [email protected]
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.UCC3809P-1G4 Texas Instruments(TI) IC PWM BUCK BST FLYBCK CM 8MSOP Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)UCC3809P-1G4 Texas Instruments(TI) IC PWM BUCK BST FLYBCK CM 8MSOP MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this pageUCC3809P-1G4 Texas Instruments(TI) IC PWM BUCK BST FLYBCK CM 8MSOP