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lead time of SN74CB3T3257DGVR is from 2 to 5 days
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60 days
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TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.SN74CB3T3257DGVR Texas Instruments(TI) IC QUAD1:2 FET MUX/DEMUX 16TVSOP Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)SN74CB3T3257DGVR Texas Instruments(TI) IC QUAD1:2 FET MUX/DEMUX 16TVSOP MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this pageSN74CB3T3257DGVR Texas Instruments(TI) IC QUAD1:2 FET MUX/DEMUX 16TVSOP