1 pcs
Mininum order quantity from 1PCS SN74SSTVF16859S8G3
Mininum order value from 1USD
2 days
lead time of SN74SSTVF16859S8G3 is from 2 to 5 days
12 hours
Fast quotation of SN74SSTVF16859S8G3 within 12 hours
60 days
60 days full quality warranty of SN74SSTVF16859S8G3
1, we will give you new and original parts with factory sealed package
2, Quality warranted: All products have to be passed our Quality Control before delivery.
2,If you need more details of SN74SSTVF16859S8G3,like pictures ,package,datasheet and so on, pls email to [email protected]
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.SN74SSTVF16859S8G3 Texas Instruments(TI) IC REG BUFF 26BIT SSTL 56-VQFN Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)SN74SSTVF16859S8G3 Texas Instruments(TI) IC REG BUFF 26BIT SSTL 56-VQFN MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this pageSN74SSTVF16859S8G3 Texas Instruments(TI) IC REG BUFF 26BIT SSTL 56-VQFN